Distance-aware Approximate Nanophotonic Interconnect

Nanophotonic Interconnect Architectures for Many-core Microprocessors

Implementing System-in-Package with Nanophotonic Interconnect

There has been significant interest in nanophotonics for global on-chip communication and for inter-socket communication between processors and/or main memory. Our goal in this short paper is to motivate future research on nanophotonic systemin-package (NSiP): an integration strategy that uses CMOScompatible nanophotonic devices to implement an efficient package-level network for high-performan...

Inductance Aware Interconnect Scaling

This paper introduces a new global-tier interconnect scaling scheme which ensures that inductance effects do not start dominating the overall interconnect performance. It is shown that for unscaled global lines, inductance effects increase as technology scales while for the scaling scheme proposed by ITRS [1], interconnects become extremely resistive and, while inductance effects diminish with ...

Distance-Aware Beamforming for Multiuser Secure Communication Systems

Typical cryptography schemes are not well suited for low complexity types of equipment, e.g., Internet of things (IoT) devices, as they may need high power or impose high computational complexity on the device. Physical (PHY) layer security techniques such as beamforming (in multiple antennas systems)  are possible alternatives to provide security for such applications. In this paper, we consid...

Interconnect Lifetime Prediction for Temperature - Aware Design

Thermal effects are becoming a limiting factor in high-performance circuit design due to the strong temperature-dependence of leakage power, circuit performance, IC package cost and reliability. Temperature-aware design tries to maximize performance under a given thermal envelope through various static and dynamic approaches. While existing interconnect reliability models assume a constant temp...